脈沖鍍銅 OMG PC600 ppr 200 填通空 填盲孔 TGV TSV 

特性和優點

1. MC-1200是一種酸性鍍銅添加劑系統，專門針對連續生產的脈沖周期性反整流進行了優化；

2. 這一過程產生了一種細粒的、韌性的、具有良好分布特征的沉積物，并由兩部分組成；

3. MC-1200和周期性反脈沖電鍍整流器的組合可以顯著縮短電鍍時間，同時保持良好的鍍銅層厚度分布比；

4. 尤其適合縱橫比在20:1的印制電路板；

1. MC-1200 is an acid copper plating additive system that has been specifically optimized for use with pulse periodic reverse rectification on a continual production basis；

2. The process produces a fine-grained, ductile deposit with excellent distribution characteristics, and is maintained with two components；

3. The combination of MC-1200 and a periodic reverse pulse plating rectifier can significantly shorten plating times while maintaining excellent copper thickness distribution ratios；

4. Especially suitable for printed circuit boards with an aspect ratio of 20:1；